09/09/2026
MIT researchers have developed a wafer-scale fabrication platform for silicon-photonics chips that are both flexible and transparent, opening up possibilities for applications that conventional rigid, opaque chips can’t easily support.
Using standard semiconductor manufacturing techniques, the team produced 300-millimeter wafers that can be bent thousands of times without losing performance. The ultrathin chips could enable new technologies including curved augmented-reality displays, discreet wearable health monitors, and other conformable optical systems.
The work demonstrates how advances in fabrication can expand the possibilities of silicon photonics beyond traditional chip formats.
Read more at the link in bio!